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CTMLP080604AF-1R0M1.0 uH ±20% SMD Multi-layer Power Chip Inductor. Magnetically shielded
- CTMLP080604AF-1R0N1.0 uH ±30% SMD Multi-layer Power Chip Inductor. Magnetically shielded
- CTMLP080604AF-1R5M1.5 uH ±20% SMD Multi-layer Power Chip Inductor. Magnetically shielded
- CTMLP080604AF-1R5N1.5 uH ±30% SMD Multi-layer Power Chip Inductor. Magnetically shielded
- CTMLP080604AF-2R2M2.2 uH ±20% SMD Multi-layer Power Chip Inductor. Magnetically shielded
- CTMLP080604AF-2R2N2.2 uH ±30% SMD Multi-layer Power Chip Inductor. Magnetically shielded
- CTMLP080604AF-3R3M3.3 uH ±20% SMD Multi-layer Power Chip Inductor. Magnetically shielded
- CTMLP080604AF-3R3N3.3 uH ±30% SMD Multi-layer Power Chip Inductor. Magnetically shielded
- CTMLP080604AF-4R7M4.7 uH ±20% SMD Multi-layer Power Chip Inductor. Magnetically shielded
- CTMLP080604AF-4R7N4.7 uH ±30% SMD Multi-layer Power Chip Inductor. Magnetically shielded
- CTMLP080604AF-R47M0.47 uH ±20% SMD Multi-layer Power Chip Inductor. Magnetically shielded
- CTMLP080604AF-R47N0.47 uH ±30% SMD Multi-layer Power Chip Inductor. Magnetically shielded